CM50 Rugged COM Express Module with Intel Atom Processor E3900 Series COM Express Mini, Type 10 The CM50C is an ultra-rugged COM Express Mini Type 10 module for rail, public transport and industrial applications. Truly Rugged COM Express Module The CM50 is an ultra-rugged COM Express module with Type 10 Pin-Out for rolling stock, public transportation and industry applications. It is operable in an extended temperature range of -40 °C up to +85 °C (Tcase). The use of soldered components makes the board resistant to shock and vibration. Versions for Extremely Harsh Environments For applications that need reliable operation even under the harshest environmental conditions, a specially hardened version is available - the CM50C. CM50C modules are embedded in a closed aluminum frame that ensures optimum EMC protection, efficient conduction cooling and extended resistance to vibration and shock. Direct air cooling is possible by placing a heat sink on the cover. The innovative mechanical design around the COM.0 electronics makes it an ultra-rugged module. Scalable Low Power Processor The Intel E3900 CPU series provides a scalable performance up to 4 cores and integrated quality graphics. Intel VT-x virtualization support allows to run multiple applications on a single hardware platform, saving costs. Due to the low power dissipation (depending on the CPU), no active cooling is necessary and very small designs are feasible. Safety, Security and Connectivity The board management controller has supervision functions (onboard voltages, temperature etc.) that make the board suitable for safety-related applications. The Trusted Platform Module supports features like secure/measured booting and fast cryptographic execution. The CM50 comes with a large variety of interfaces, including, e.g., Digital Display Interfaces, HD Audio, PCI Express and Gigabit Ethernet. This enables implementing many functions on a very small form factor. Long-Term Available Long-term availability ensures an extended product life and future-safety. Intel Atom E3900 series Up to 8 GB DDR3 RAM with ECC Intel VT-x virtualization support Very small form factor Trusted Platform Module Board management controller with safety-related supervision functions Conduction cooling -40 °C to +85 °C Tcase Compliant with COM Express Mini, type 10 PICMG COM.0 and Ultra-Rugged COM versions

CC10 Rugged COM Express Module with ARM i.MX6 COM Express Compact, Type 6 The CC10 is an ARM i.MX6 based Rugged COM Express type 6 module with a Cortex-A9 architecture and an onboard FPGA for flexible, customizable I/O. It is designed for industrial automation, medical computers, in-vehicle computers, and embedded computers in transportation. The CC10 supports conductive cooling technology and is 100% EMC proof. Scalable Processor Performance The CC10 is an Ultra-Rugged COM Express module built around the NXP (formerly Freescale) ARM i.MX 6 series of processors with a Cortex-A9 architecture. Supporting different types of the i.MX 6Solo, 6DualLite, 6Dual and 6Quad families, the computer-on-module is widely scalable, e.g., to processing or graphics requirements. Where less performance is needed, you can optimize costs by choosing a single- or dual-core processor instead of a quad core. Perfect for Harsh Environments For applications that need reliable operation even under the harshest environmental conditions, a specially hardened version is available - the CC10C. CC10C modules are embedded in a closed aluminum frame that ensures optimum EMC protection and efficient conduction cooling and supports an extended operating temperature range of -40 °C to +85 °C. Direct air cooling is possible by placing a heat sink on the cover. The innovative mechanical design around the COM.0 electronics makes it an ultra-rugged module. With the mechanics for conduction cooling, the module's size extends to 105 x 105 mm. The CC10 is based on the "Compact", 95 x 95 mm form factor and Type 6 connector pin-out. The exclusive use of soldered components ensures that the COM withstands shock and vibration. The design is optimized for conformal coating. Adding to its rugged design, the computer-on-module's range of supported functions leave almost nothing to wish for. With a maximum of 4 GB DDR3 RAM and an onboard eMMC device, the CC10 covers all basic memory needs. 3-Gbit SATA is provided for external mass storage. I/O Flexibility One of the biggest strengths of the CC10 lies in its I/O flexibility. The i.MX 6 provides an abundance of onchip controllers and interfaces, including Gigabit Ethernet, USB 2.0 (also with OTG/client support) and PCI Express. Different video outputs like LVDS and HDMI/DVI, audio and an optional camera interface make the card fit for multimedia applications. Other serial ports provide UARTs or CAN bus. Where the processor's standard functions are not a perfect match, an onboard FPGA opens up 140 signal pins for user I/O. As IP cores are easy to integrate, the CC10 becomes a semi-custom solution with the suitable functionality even for more specialized applications. The resulting I/O functionality in the ordered version depends on the customer's requirements and will always be a tailored combination of i.MX 6 and FPGA-based I/O, without the need for a completely new design. For evaluation and development purposes a microATX carrier board, the XC15, is available. NXP ARM i.MX 6 Series Quad-core processor Comprehensive usage of i.MX 6 I/O Configurable FPGA I/O with 140 pins Maximum flexibility in interface configuration Up to 4 GB DDR3 SDRAM eMMC multimedia card U-Boot Universal Boot Loader -40 °C to +85 °C Tcase Conduction cooling Compliant with COM Express Compact, type 6 PICMG COM.0 and Ultra-Rugged COM versions

CB71 Rugged COM Express Module with AMD Ryzen Embedded COM Express Basic, Type 6 Rugged COM Express Basic type 6 module with AMD Ryzen Embedded processor. For data acquisition, infotainment, transcoding and live 3D in data and graphic intensive applications. Truly Rugged COM Express Module The CB71 is a rugged COM Express module with Type 6 Pin-Out for demanding applications in the railway, public transportation and industrial markets. Its high-performance features match the requirements of applications like data acquisition, infotainment, transcoding or live 3D. The rugged CB71 is designed for operation from -40 °C to +85 °C. To withstand serious shock and vibration, only soldered-down components are used. The design is optimized for conformal coating. Also for Extremely Harsh Environments For applications that need reliable operation even under the harshest environmental conditions, a specially hardened version is available - the CB71C. CB71C modules are embedded in a closed aluminum frame that ensures optimum EMC protection and efficient conduction cooling. Direct air cooling is possible by placing a heat sink on the cover. The innovative mechanical design around the COM.0 electronics makes it an ultra-rugged module. Powerful Processing and Graphics on a Single Chip The CB71 is based on the AMD Ryzen Embedded V1000/R1000 APU family. It comes with a Radeon Vega next-generation 3D graphics engine and supports up to four displays with up to 4k resolution, without the need for additional graphics hardware. With two (R1000) or four (V1000) high-performance processor cores and AMD-V extension, the CB71 is also suitable for virtualization. Excellent Price/Performance & Flexibility The CB71 can be equipped with an R1000 dual-core APU or a V1000 quad-core APU offering long-term availability and scalable performance and supporting ECC. Passive cooling is possible with low-power versions. Safety and Security The board management controller has supervision functions (onboard voltages, temperature etc.) that make the board suitable for safety-related applications. In addition, the CB71 has a Trusted Platform Module and supports hardware memory encryption, providing protection against both physical and inter-VM storage attacks. This is essential for security-critical applications such as payment and ticketing terminals, fleet management or monitoring. Memory and I/O The CB71 can be equipped with up to 32 GB of directly soldered DDR4 main memory and up to 64 GB eMMC. Available high-speed interfaces include PCI Express 3.0 links, DDI (DP, eDP, HDMI), SATA 3.0, Gigabit Ethernet and USB 3.2 Gen 1x1. AMD Ryzen Embedded V1000/R1000 APU Up to 32 GB DDR4 RAM with ECC Up to 4 Digital Display Interfaces (DP, eDP, HDMI, DVI) Hardware memory encryption Board management controller with safety-related supervision functions Virtualization-ready Excellent price-performance ratio -40 °C to +85 °C Tcase, depending on processor Conduction cooling Compliant with COM Express Basic, type 6 PICMG COM.0 and Ultra-Rugged COM versions

PX7 PCIe Mini Card to M.2 Adapter PCI Express Mini Card The PX7 is a PCI Express Mini Card designed for converting form factor PCI Express Mini to M.2. PCI Express Mini Card to M.2 Adapter The PX7 is a PCI Express Mini Card designed for converting form factor PCI Express Mini to M.2. In addition, it converts PCIe x1 on the PCI Express Mini side into USB 3.2 Gen 1x1 featured on the M.2 side. USB 3.2 Gen 1x1 Extension for Box PCs Typically, box PCs from duagon are equipped with PCI Express Mini Card slots which support PCIe x1 and USB 2.0 but not USB 3.2 Gen 1x1. The PX7 extends the capability of the box PC families by enabling the use of USB 3.2 Gen 1x1 devices (i.e. LTE-Advanced Modem) in M.2 form factor. The PX7 also supports one SIM card integrated in the box PCs. Fit for the Future The PX7 is the ideal solution for LTE Advanced, as it supports transmission rates of up to 500 Mbit/s (Cat 11/Cat 12). Optionally, the PX7 is also available as a USB 2.0 solution for slower LTE modems (Cat 6). Conduction Cooling Option duagon also offers a conduction cooled version of the PX7 including an LTE modem for the use within box PCs. M.2 (NGFF) interface for LTE modems Possible integration of LTE-Advanced modems USB 3.2 Gen 1x1 support PCI Express Mini Card form factor Possible upgrade of existing PCI Express Mini Card slots Conduction cooling frame available -40 °C to +85 °C

SA24M IBIS Master SA-Adapter The SA24M is an IBIS master interface adapter with one IBIS master interface. Integrated Board Information System The SA24M provides one IBIS master interface with an external 24 V supply. While a fieldbus master controls the data traffic, the data transfer between master and slave participants is initiated only by the master. IBIS is a fieldbus used in public transport vehicles. It is based on a UART structure and can therefore be combined with duagon products that support any kind of UART interfaces together with SA-Adapter slots. Versatile I/O Features SA-Adapters are small universal boards providing the line drivers for legacy serial I/O, fieldbus interfaces and other I/O functions. One serial line is provided per adapter, which can be plugged directly to duagon products such as CPU boards as a mezzanine. Alternatively, the adapter can be connected to the front panel via ribbon cable. Interface Extensibility The SA concept allows to add additional I/O interfaces to duagon products, enhancing flexibility for line transceivers and isolation requirements. Compatibility of SA-Adapters or a combination thereof with duagon products is determined by mechanical, performance, FPGA and operating system criteria and needs to be verified for every board configuration requested. Long-Term Availability Long-term availability ensures an extended product life and future-safety. 1 channel master Over-current and short-cut protection Optical isolation -40 °C to +85 °C

F204 M-Module Carrier Board for 1 Mezzanine Card 3U CompactPCI The F204 is a 3U M-Module carrier board for universal I/O on the CompactPCI bus. Universal I/O on CompactPCI The F204 is a 3U M-Module carrier board for universal I/O on the CompactPCI bus. It allows high flexibility in applications such as data acquisition or process control. One M-Module may be installed on the F204, which needs only one slot on the CompactPCI bus. M-Modules are screwed tightly on the board and require no separately mounted transition panel. The F204 offers developers instant access to more than 70 different M-Modules for I/O in fields such as process I/O, measurement, instrumentation, motion control, communication, and development. Long-Term Availability Long-term availability ensures an extended product life and future-safety. 1 CompactPCI bus slot 1 M-Module slot -40 °C to +85 °C versions with qualified components

BL51E Industrial Computer for Transportation with Intel Atom Processor E3900 Series Railway & Automotive Embedded Computer for Communication & Control The BL51E is a rugged, fanless EN 50155 railway and automotive box computer for in-vehicle functions like Passenger Information Systems (PIS) and surveillance based on Intel Atom Processor E3900. For IoT or Storage-Intensive Applications The BL51E is a fanless, maintenance-free box computer for embedded applications in transportation, e.g., in trains, buses or commercial vehicles. Its HDD/SSD shuttle provides the storage capacity necessary for entertainment servers or video surveillance systems. A vast number of I/O functions and options seamlessly link the BL51E to the IoT, making vehicles smart. A Multi-Talent for Wireless Communication The BL51E can take over typical on-board wireless functions, whether it is an Internet connection for passengers or locating the vehicle. A GNSS positioning interface is available. Four PCI Express Mini Card slots each with two micro-SIM slots and dual SIM support provide maximum flexibility in implementing mobile service standards up to 4G LTE or WLAN/WLAN IEEE 802.11, and derivates. Solid Processing Performance The BL51E is powered by an Intel Atom E3950 running at 1.6 GHz. Other dual/quad core processors of the Intel Atom E3900 series can be used, giving high scalability in CPU performance. The box PC features up to 8 GB DDR3 SDRAM and offers an SD card and a SATA HDD/SSD shuttle both accessible at the rear, plus in-system eMMC memory. Fanless Operation for Mobile Applications The system is designed for fanless operation at temperatures from -40 °C to +70 °C (+85 °C for up to 10 minutes). Its rugged aluminum housing with cooling fins serves as a heat sink for the internal electronics and provides conduction cooling. A Multitude of I/O The BL51E supports two DisplayPort interfaces with maximum 4K resolution, four Gigabit Ethernet, two with PoE+ capability, two USB 2.0, legacy serial I/O (RS232) and CAN bus, general purpose inputs and relay outputs. Railway-Compliant PSU with Ignition Function The BL51E has a class S2 wide range power supply in compliance with EN 50155 and prepared for ISO 7637-2 (E-mark for automotive). Standard versions support 30 W with 24 V DC nom. (10 V to 50.4 V), 110 V DC nom. is available as an option. In the 24 V DC version, power can be switched on and off using an ignition signal on the power connector, and a run-down time after switching off the ignition signal can be adjusted by software. Long-Term Available and Future-Safe Long-term availability ensures an extended product life and future-safety. Intel Atom E3900 series Up to 8 GB DDR3 DRAM soldered, ECC 1 HDD/SSD shuttle 4 Gb Ethernet ports 4 PCI Express Mini Card slots with micro-SIM slots WLAN, 4G LTE, GPS or GLONASS 2 USB 2.0, 2 DisplayPort, 1 CAN, 4 UARTs 24 and 36 VDC nom. class S2 PSU, with ignition -40 °C to +70 °C (+85 °C), fanless Conformal coating of internal components EN 50155 compliant (railways) Prepared for ISO 7637-2 (E-mark for automotive)

BL72E Rugged Embedded Box PC with AMD Ryzen for Transportation Maintenance-Free Industrial System for High-Performance Computing Embedded box PC for passenger entertainment, infotainment, internet-on-board, IoT, virtualization, CCTV and GNSS positioning For IoT or Storage-Intensive Applications The BL72E is a fanless, maintenance-free box computer for embedded applications in transportation, e.g., in trains. It offers a SATA HDD/SSD shuttle providing the storage capacity necessary for entertainment servers or video surveillance systems, plus eMMC memory and an M.2 slot for PCIe based storage (NVMe). Cost-Efficient High-End Processor Performance The BL72E is based on AMD's Ryzen V1000 APU family featuring excellent power-per-watt performance and a Radeon Vega next-generation 3D graphics engine. With up to four high-performance processor cores and AMD virtualization support, and up to 32 GB soldered-down DDR4 SDRAM, the BL72E offers powerful computing for handling data intensive work loads efficiently, e.g. for implementation of complex algorithms for deep learning or machine intelligence. Multi-Talent for Wireless Communication The BL72E can take over typical on-board wireless functions, such as an Internet connection for passengers or locating the vehicle. A GNSS positioning interface is available. Two PCI Express Mini Card slots and two M.2 slots provide maximum flexibility in implementing mobile service standards up to 4G LTE or WLAN IEEE 802.11, and derivates. A total of eight externally accessible micro-SIM card slots is available. Multitude of I/O The BL72E supports one DisplayPort interface with maximum 4K resolution. A multitude of other I/O is available, including four Gigabit Ethernet, audio, two USB 3.2 Gen 1x1, RS232, RS422/RS485, IBIS. Digital I/O, MVB or a CAN interface can optionally be implemented. Railway-Compliant PSU with Ignition Function The BL72E comes with a class S2 wide range power supply and complies to EN 50155. The power can be switched on and off using an ignition signal on the power connector. Fanless Operation for Mobile Applications The system offers long-term availability until 2029 and is designed for fanless operation at temperatures from -40 °C to +70 °C (+85 °C for up to 10 minutes). Its rugged aluminum housing with cooling fins serves as a heat sink and provides conduction cooling. AMD V1000 APU, up to 32 GB DDR4 DRAM WLAN, 4G LTE, GNSS 2.5" HDD/SSD, NVMe storage Gigabit Ethernet, USB 3.2 Gen 1x1, DisplayPort, Audio RS232, RS422/RS485, IBIS 1 PCIe Mini card slot for MVB, CAN Class S2 wide-range power supply, incl. ignition -40 °C to +70 °C (+85 °C), fanless Compliant to EN 50155 (railways)

F75P Vital Embedded Single Board Computer, 3 Intel Atom E6xx 3U CompactPCI PlusIO The F75P is an x86 Intel Atom E680T based fail-safe vital embedded computer, certified to SIL 4 with onboard dual redundancy for functional safety and a third CPU for I/O communication. It targets safety-critical applications in embedded railway and wayside computers and in industrial automation. F75P is also part of the duagon SAFE CONTROL System. The F75P is a COTS safe computer with onboard functional safety that unites three CPUs on one 3U CompactPCI PlusIO card. It makes Intel Atom E6xx ("E600") performance with dual redundancy extremely compact, mainly targeting railway applications. Two independent Control Processors (CP) with independent DDR2 RAM and Flash and a supervision structure provide safety: For SIL 3 / SIL 4: With redundant software running on F75P and, e.g., with the software instances on the two CPs comparing their output. This way the board becomes a fail-silent subsystem, i.e. it can shut down in case of a fatal fault. For up to SIL 2: Using just one of the two CPs or using both CPs independently for different applications. This way on each CP a 1oo1D safety application up to SIL 2 can be realized. Its I/O Processor (IOP) is built up like a classic CompactPCI CPU board, including DDR2 RAM, front and rear I/O. The front connectors include VGA, two USB 2.0, and two 100-Mbit Ethernet channels. At the rear, the board provides another four USB 2.0, two Fast Ethernet ports, one 3-Gbit SATA and one PCI Express x1 link. These interfaces comply with the standardized pinout of CompactPCI PlusIO (PICMG 2.30). An onboard mSATA slot makes for scalable, robust mass storage. The intelligent board management controller of the IOP logs events such as reset, overvoltage or undervoltage in a non-volatile FRAM. The Control (CP) and I/O Processors (IOP) communicate via internal links provided by an FPGA. The CPs are designed to run a deterministic real-time operating system such as the QNX Neutrino RTOS Safe Kernel. It is also possible to implement diversitary software on both kernels. The F75P can replace multiprocessing systems with CPU redundancy and I/O by a small-footprint, low-power solution that is flexible for different types of application scenarios. It uses a single +5 V supply voltage to allow operation with external power supplies that do not generate +3.3 V. F75P-based systems are generally certifiable up to SIL 4. Since the card has no voter of its own, the software implements and controls functional safety behavior. The customer can either add the software himself or purchase it from duagon. The safety features such as the CP supervisors are designed to SIL 4 according to [EN50129]. A railway certification package including the "safety case" document and a certificate from TÜV SÜD is available. Its rugged set-up also make the F75P rail-ready: with assets like conformal coating and an operating temperature of -40 °C to +70 °C (10 min @ +85 °C) with qualified components, it is fully EN 50155 compliant. It is 6 HP and comes with RJ45 Ethernet connectors and a large heat sink. 2x Intel Atom E6xx, up to 1 GB DDR2 RAM (each) for onboard dual redundancy 1x Intel Atom E6xx, up to 2 GB DDR2 for I/O Independent supervisors for each block Fail-safe board architecture Event logging SIL 4 certification packages available for hardware and software (QNX) TÜV Süd certified according to EN 50129 (SIL 4), EN 50128 (SIL 4) and IEC 61508 (SIL3) Full EN 50155 compliance -40 °C to +70 °C (+85 °C) Conformal coating

F27P Single Board Computer with AMD Ryzen Embedded 3U CompactPCI PlusIO Embedded processor board with AMD Radeon series for embedded computers in industrial automation and rail transport systems Scalable AMD Ryzen Embedded CPU The F27P CompactPCI PlusIO CPU board is based on the AMD Ryzen Embedded APU family. A variety of pin-compatible processors allow scalable board performance. duagon designs support dual-core and quad-core CPUs with a TDP range of a moderate 12 W up to 53 W with high performance. Designed for Comprehensive Requirements Memory and mass storage on F27P match the needs of multi-core computing: up to 32 GB of soldered-down error-correcting DDR4 RAM and eMMC provide a solid base for data-intensive tasks. A non-volatile RAM can permanently store critical runtime data. 2.5" HDD/SSD and NVMe devices can be added on an extension card as needed. The F27P comes with an advanced Board Management Controller (BMC) that monitors onboard voltages and temperatures and performs dedicated tasks like watchdog management, power supply control and reset handling. A Trusted Platform Module (TPM 2.0) provides support for remote device authentication, measured boot, and secure updates. Modular Concept The F27P features up to three RJ45 or M12 Ethernet front connectors on 4 or 8 HP. Two USB 3.2 connectors and one DisplayPort round out the board’s essential front I/O. The efficient design includes an optional extension card for additional I/O. Aside from mass storage, a number of USB and UART interfaces can cover legacy tasks. This saves both costs and space especially in retrofit applications. Even with the extension card, the F27P stays a compact CPU assembly in the system. The processor and I/O options offered are backed by a tailored thermal design, making the F27P a truly modular CPU board. CompactPCI PlusIO (PICMG 2.30) The F27P supports the CompactPCI PlusIO (PICMG 2.30) specification, making it usable in a hybrid system with both CompactPCI and CompactPCI Serial peripheral boards. Compliant to the standard, the J2 rear I/O connector features 2x 1G Ethernet, 4x PCI Express x1, 4x USB 2.0 as well as 2x SATA. For Embedded and Harsh Environments The CPU board was designed to resist extreme temperatures as well as shock and vibration in applications where high reliability is essential. The F27P is suited for the rail market, industrial automation or the power and energy sector, for example. duagon offers passively cooled models, supporting a system ambient temperature of up to +70 °C, and high-performance models with forced air cooling for moderate temperature requirements. The F27P operates in Linux and Windows environments as well as under real-time operating systems. Long-Term Availability Long-term availability minimizes life cycle management and makes the F27P a long-lasting investment. AMD Ryzen Embedded APU Up to 32 GB soldered DDR4 ECC RAM Board Management Controller Front I/O: 3x 1G Ethernet RJ45 or M12, 2x USB 3.2 Gen 1x1, 1x DisplayPort Rear I/O: 2x 1G Ethernet, 4x PCIe x1, 4x USB 2.0, 2x SATA Modular mass storage and I/O options -40 °C to +70 °C (system ambient) operating temperature Conduction cooling also possible