F27P - Single Board Computer with AMD Ryzen Embedded

AMD Ryzen Embedded Processor

The F27P is a CompactPCI PlusIO CPU module based on AMD's latest Ryzen Embedded APU family. AMD offers a great variety of pin-compatible CPUs and APUs, thus covering a wide range of processing and graphics power in a single FP5 package.

duagon offers both passively cooled models for the railway sector, for example, as well as high-performance models with forced air cooling. F27P is equipped with a powerful Radeon Vega 3D graphics engine and supports multiple displays via daisy-chaining with a resolution of up to 4096 × 2160 pixels without the need for additional graphics hardware.

Variable Front Design

Unlike other CPU boards the F27P features up to three RJ45 (single-slot) or M12 (dual-slot) Ethernet front connectors making it more cost-effective by reducing the need for extra modules. Other front I/O include two USB 3.2 Gen 1x1 connectors and one DisplayPort connector.

CompactPCI PlusIO (PICMG 2.30)

The F27P supports the CompactPCI PlusIO (PICMG 2.30) specification, which makes it usable in a hybrid system for control of both CompactPCI and CompactPCI Serial peripheral boards. Compliant to the standard, four USB 2.0, four PCI Express x1 as well as two Gigabit Ethernet and two SATA interfaces are accessible on the J2 rear I/O connector.

Designed for Extreme Temperatures

The CompactPCI PlusIO board has been designed for applications with extreme temperatures, where high reliability and long-term availability are essential requirements. The F27P is suited for applications in the rail market, industrial automation or the power and energy sector, for example. duagon offers passively cooled models for the railway sector, supporting the extended -40 °C to +85 °C operation range, as well as high-performance models with forced airflow cooling for moderate temperature requirements.

Long-Term Availability

Long-term availability minimizes life-cycle management and makes the F27P a long-lasting investment.

This Product is Coming Soon

Products with a "Coming Soon" label have not yet passed the conformity assessment procedure. Such products will be sold only when all conformity assessments were passed.


  • AMD Ryzen Embedded APU
  • Up to 32 GB DDR4 RAM soldered, ECC
  • For CompactPCI 2.0 systems or CompactPCI PlusIO 2.30 hybrid systems (2.0 and CPCI-S.0)
  • Hardware memory encryption
  • Board management controller with safety-related supervision
  • Up to 11 Radeon Vega compute units
  • Front I/O: 3x 1Gb Ethernet RJ45 or M12, 2x USB 3.2 Gen 1x1, 1x DisplayPort
  • Rear I/O: 2x 1Gb Ethernet, 4x PCIe x1, 4x USB 2.0, 2x SATA
  • -40 °C to +85 °C
  • Conduction cooling also possible