F27P - Single Board Computer with AMD Ryzen Embedded

Scalable AMD Ryzen Embedded CPU

The F27P CompactPCI PlusIO CPU board is based on the AMD Ryzen Embedded APU family. A variety of pin-compatible processors allow scalability of the board’s performance level. duagon designs support dual-core and quad-core CPUs with a TDP range of a moderate 12 W up to 53 W with high performance.

Designed for Comprehensive Requirements

Memory and mass storage on F27P match the needs of multi-core computing: up to 32 GB of soldered-down DDR4 RAM with ECC and eMMC provide a solid base for data-intensive tasks. A non-volatile RAM can permanently store critical runtime data. 2.5" HDD/SSD and NVMe devices can add mass storage as needed on an extension card.

The F27P comes with an advanced Board Management Controller (BMC) that monitors onboard voltages and temperature and performs dedicated tasks like watchdog management, power supply control and reset handling. A Trusted Platform Module (TPM 2.0) provides support for remote device authentication, measured boot, and secure updates.

Modular Concept

The F27P features up to three RJ45 or M12 Ethernet front connectors on 4 HP or 8 HP. Two USB 3.2 connectors and one DisplayPort round out the board’s essential front I/O.

The efficient design includes an optional extension card for additional I/O. Aside from mass storage, a number of USB and UART interfaces can cover legacy tasks. This saves both costs and space especially in retrofit applications. Even with the extension card, the F27P stays a compact CPU assembly in the system. The processor and I/O options offered are backed by a tailored thermal design, making the F27P a truly modular CPU board.

CompactPCI PlusIO (PICMG 2.30)

The F27P supports the CompactPCI PlusIO (PICMG 2.30) specification, which makes it usable in a hybrid system for control of both CompactPCI and CompactPCI Serial peripheral boards. Compliant to the standard, the J2 rear I/O connector features four USB 2.0, four PCI Express x1 as well as two Gigabit Ethernet and two SATA interfaces.

For Embedded and Harsh Environments

The CPU board was designed to resist extreme temperatures as well as shock and vibration in applications where high reliability is essential. The F27P is suited for the rail market, industrial automation or the power and energy sector, for example. duagon offers passively cooled models, supporting a system ambient temperature of up to +70 °C, and high-performance models with forced air cooling for moderate temperature requirements.

The F27P operates in Linux and Windows environments as well as under real-time operating systems.

Long-Term Availability

Long-term availability minimizes life cycle management and makes the F27P a long-lasting investment.


  • AMD Ryzen Embedded APU
  • Up to 32 GB DDR4 RAM soldered, ECC
  • Board management controller
  • Front: 3x Gb Ethernet RJ45 or M12, 2x USB 3.2 Gen 1x1, 1x DisplayPort
  • Rear: 2x Gb Ethernet, 4x PCIe x1, 4x USB 2.0, 2x SATA
  • Modular mass storage and I/O options
  • -40 °C to +70 °C (system ambient) operating temperature
  • Conduction cooling also possible