F27P - Single Board Computer with AMD Ryzen Embedded

Scalable AMD Ryzen Embedded CPU

The F27P CompactPCI PlusIO CPU board is based on the AMD Ryzen Embedded APU family. A variety of pin-compatible processors allow scalable board performance. duagon designs support dual-core and quad-core CPUs with a TDP range of a moderate 12 W up to 53 W with high performance.

Designed for Comprehensive Requirements

Memory and mass storage on F27P match the needs of multi-core computing: up to 32 GB of soldered-down error-correcting DDR4 RAM and eMMC provide a solid base for data-intensive tasks. A non-volatile RAM can permanently store critical runtime data. 2.5" HDD/SSD and NVMe devices can be added on an extension card as needed.

The F27P comes with an advanced Board Management Controller (BMC) that monitors onboard voltages and temperatures and performs dedicated tasks like watchdog management, power supply control and reset handling. A Trusted Platform Module (TPM 2.0) provides support for remote device authentication, measured boot, and secure updates.

Modular Concept

The F27P features up to three RJ45 or M12 Ethernet front connectors on 4 or 8 HP. Two USB 3.2 connectors and one DisplayPort round out the board’s essential front I/O.

The efficient design includes an optional extension card for additional I/O. Aside from mass storage, a number of USB and UART interfaces can cover legacy tasks. This saves both costs and space especially in retrofit applications. Even with the extension card, the F27P stays a compact CPU assembly in the system. The processor and I/O options offered are backed by a tailored thermal design, making the F27P a truly modular CPU board.

CompactPCI PlusIO (PICMG 2.30)

The F27P supports the CompactPCI PlusIO (PICMG 2.30) specification, making it usable in a hybrid system with both CompactPCI and CompactPCI Serial peripheral boards. Compliant to the standard, the J2 rear I/O connector features 2x 1G Ethernet, 4x PCI Express x1, 4x USB 2.0 as well as 2x SATA.

For Embedded and Harsh Environments

The CPU board was designed to resist extreme temperatures as well as shock and vibration in applications where high reliability is essential. The F27P is suited for the rail market, industrial automation or the power and energy sector, for example. duagon offers passively cooled models, supporting a system ambient temperature of up to +70 °C, and high-performance models with forced air cooling for moderate temperature requirements.

The F27P operates in Linux and Windows environments as well as under real-time operating systems.

Long-Term Availability

Long-term availability minimizes life cycle management and makes the F27P a long-lasting investment.


  • AMD Ryzen Embedded APU
  • Up to 32 GB soldered DDR4 ECC RAM
  • Board Management Controller
  • Front I/O: 3x 1G Ethernet RJ45 or M12, 2x USB 3.2 Gen 1x1, 1x DisplayPort
  • Rear I/O: 2x 1G Ethernet, 4x PCIe x1, 4x USB 2.0, 2x SATA
  • Modular mass storage and I/O options
  • -40 °C to +70 °C (system ambient) operating temperature
  • Conduction cooling also possible