F50P - Embedded Single Board Computer with QorIQ MPC8548 (Product Discontinued)

The F50P is a versatile, rugged PowerPC based single-board computer for embedded applications. It is controlled by an MPC8548, or optionally an MPC8543 PowerPC processor (alternatively with encryption unit) with clock frequencies between 800 MHz and 1.5 GHz. The SBC is equipped with ECC-controlled, soldered-on DDR2 RAM for data storage, with up to 16 GB of solid-state Flash disk for program storage as well as industrial FRAM and SRAM.

The CPU card provides up to three Gigabit Ethernet channels, six USB ports, up to two SATA interfaces and up to 64 user-definable I/O lines controlled by an optional onboard FPGA. These interfaces can be combined in many variations and are available at the front or at the rear using the board's J2 connector. The J2 pin assignment and connector type are in compliance with the PICMG 2.30 CompactPCI PlusIO standard - the migration path towards CompactPCI Serial. Two USB and two RJ45 Ethernet connectors are already provided at the front panel, and space is left for an optionalVGA connector.

The large FPGA on the F50P allows to add additional user-defined functions such as graphics, touch, serial interfaces, fieldbus controllers, binary I/O etc. for the needs of the individual application in an extremely flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be made inside the boot Flash during operation. If the FPGA is assembled, the card needs an extra 4 HP in front panel space.

Equipped with a PCI-bridge chip, the F50P offers a full CompactPCI interface (system slot functionality) for reliable system expansion. Apart from that, the F50P can also be used as a busless, stand-alone board, with power supply from the backplane.

Being designed for operation in a conduction or convection cooled environment, the F50P provides flexibility also in its cooling concept. Its firmly plugged-on CPU module is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling for the F50C model, which is also available by standard. For air cooling, the F50P version comes with a tailor-made heat sink on top of the cover, requiring an 8-HP front panel, for an extended temperature range of -40°C to +70°C. The soldered components on the F50P withstand shock and vibration, and the board design is optimized for conformal coating.

The F50P comes with MENMON support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.


  • 32-bit CompactPCI and PICMG 2.30 PlusIO
  • 8 HP or 12 HP with front I/O
  • MPC8548 (or MPC8543), up to 1.5 GHz
  • Up to 2 GB (ECC) DDR2 SDRAM
  • Up to 128 KB FRAM, 2 MB SRAM
  • Up to 16 GB SSD Flash
  • Standard front I/O: 2 Gb Ethernet, 2 USB
  • Standard rear I/O: 4 USB, 2 SATA
  • FPGA for user-defined I/O functions (option)
  • MENMON BIOS for PowerPC cards
  • -40°C to +70°C (8 HP) (screened)


PowerPC PowerQUICC III MPC8548, MPC8548E, MPC8543 or MPC8543E
  • 800 MHz up to 1.5 GHz
  • Please see Standard Configurations for available standard versions.
  • e500 PowerPC core with MMU and double-precision embedded scalar and vector floating-point APU
  • Integrated Northbridge and Southbridge
  • 2 x 32 KB L1 data and instruction cache, 512 KB / 256 KB L2 cache integrated in MPC8548/MPC8543
  • Up to 2 GB SDRAM system memory
    • Soldered
    • DDR2 with or without ECC
    • Up to 300 MHz memory bus frequency, depending on CPU
  • Up to 16 GB soldered Flash disk (SSD solid state disk)
  • Up to 32 MB additional DDR2 SDRAM, FPGA-controlled, e.g. for video data
  • 16 MB boot Flash
  • 2 MB non-volatile SRAM
    • With GoldCap backup
  • 128 KB non-volatile FRAM
  • Serial EEPROM 4 kbits for factory settings
Mass Storage
  • FPGA-controlled (optional)
  • VGA connector prepared at front panel
  • USB (host)
    • Five USB 2.0 host ports
    • One Type A connector at front panel
    • Four ports via rear I/O J2
    • OHCI and EHCI implementation
    • Data rates up to 480 Mbit/s
  • USB (client)
    • One USB client port on Type A connector at front panel
    • Via UART-to-USB converter
    • Data rates up to 115.2 kbit/s
    • 16-byte transmit/receive buffer
    • Handshake lines: none
  • Ethernet
    • Up to three 10/100/1000Base-T Ethernet channels with MPC8548/E (two channels with MPC8543/E)
    • Two RJ45 connectors at front panel
    • Two front-panel LEDs for channels for LAN link, activity status and connection speed
    • All three possible also via rear I/O J2 (Note: requires additional Ethernet transformers on rear I/O board or backplane.)
    • See interface configuration matrix showing possible I/O combinations (PDF)
  • User-defined I/O
Front Connections (Standard)
  • One USB 2.0 host (Type A)
  • One USB client (Type A)
  • Two Ethernet (RJ45)
Rear I/O
  • The FPGA offers the possibility to add customized I/O functionality. See Options
  • Standard: FPGA not assembled
  • Real-time clock with GoldCap backup
  • Temperature sensor, power supervision and watchdog
  • Status LED at the front
  • Reset button
CompactPCI Bus
  • Compliance with CompactPCI Core Specification PICMG 2.0 R3.0
  • System slot
  • 32-bit/32-MHz PCIe-to-PCI bridge
  • V(I/O): +3.3 V (+5 V tolerant)
Busless Operation
  • Board can be supplied with +5 V, +3.3 V and +12 V from backplane, all other voltages are generated on the board
  • Backplane J1 connector used only for power supply
Electrical Specifications
Supply voltage/power consumption:
  • +5 V (-3%/+5%), 800 mA approx.
  • +3.3 V (-3%/+5%), 350 mA approx.
  • ±12 V (-5%/+5%), 1 A approx.
Mechanical Specifications
  • Dimensions: conforming to CompactPCI specification for 3U boards
  • Front panel:
    • 8 HP without FPGA
    • 12 HP with FPGA
  • Weight: 626 g
Environmental Specifications
  • Temperature range (operation):
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to + 3,000 m
  • Shock: 15 g, 11 ms
  • Bump: 10 g, 16 ms
  • Vibration (sinusoidal): 1 g, 10..150 Hz
  • Conformal coating on request
162,822 h @ 40°C according to IEC/TR 62380 (RDF 2000)
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
Tested according to EN 55022 (radio disturbance), IEC 61000-4-2 (ESD) and IEC 61000-4-4 (burst)
BIOS/Boot Loader
Software Support