MM1 - ESMini COM with Intel Atom (Product Discontinued)

The MM1 is an ultra-small Computer-On-Module of the rugged ESMini family. Together with an application-specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission-critical environments.

The MM1 is controlled by the Intel Atom processor, a first generation IA-32 core based on 45nm process technology. Due to the new power architecture of the Intel Atom CPU, the MM1 has a total power consumption of max. 5 to 10 W, while having a clock frequency of up to 1.6 GHz.

The MM1 accommodates up to 1 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

The MM1 offers a multitude of I/O: besides modern serial I/O like one PCI Express x1 link, LVDS, SDVO, high-definition audio, SATA and USB, it also provides legacy I/O (2 CAN, 2 COM, 2 Fast Ethernet, 2 I2C) and up to 120 FPGA signals.

The MM1 is completed by a board management controller for temperature and power supervision. It comes with a Phoenix Award BIOS configurable for the final application.

The MM1 is screened for operation in a -40°C to +85°C temperature range (Tcase, -25°C to +85°C for board versions with 1 GB DRAM). As all ESMini modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover. Where operation temperatures are moderate, the module may even do without the frame and cover, with a suitable low-power processor and airflow. ESMini modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. The MM1 supports a 95x55mm form factor.

For evaluation and development purposes a microATX carrier board is available.


  • Intel Atom Z530 or Z510, up to 1.6 GHz
  • Up to 1 GB DDR2 SDRAM
  • 1 PCI Express
  • Up to 2 Fast Ethernet interfaces
  • 8 USB 2.0 (1 client)
  • 2 UARTs
  • Up to 2 CAN bus interfaces
  • Intel HD Audio
  • -40°C to +85°C Tcase screened (-25°C to +85°C Tcase with 1 GB DRAM)
  • Conduction cooling


  • Intel Atom Z530 or Z510
    • Up to 1.6 GHz processor core frequency
    • 400 MHz or 533 MHz system bus frequency
  • Chipset
    • Intel system controller hub US15W
  • 512 KB L2 cache integrated in Atom processor
  • Up to 1 GB DDR2 SDRAM system memory
    • Soldered
    • 400/533 MHz memory bus frequency locked to the FSB frequency
Serial ATA (SATA)
  • One port via ESMini connector
  • Transfer rates up to 100 MB/s
  • Via PATA-to-SATA converter
  • Integrated in Intel System Controller Hub US15W
  • Maximum resolution: 1366x768 pixels
  • 1 SDVO port
  • 1 LVDS port
    • 112 MHz maximum pixel clock
    • 18 or 24 bits pixel color depths
  • Available via ESMini connector
  • Eight USB 2.0 host ports (or 7 host ports and 1 client port, adjustable by software)
    • Via ESMini connector
    • Six of these ports also support USB 1.1 (UHCI implementation)
  • EHCI implementation
  • Data rates up to 480 Mbit/s
  • Up to two 10/100Base-T Ethernet channels
  • Two status LEDs per channel
  • Available via ESMini connector
  • Two interfaces
  • RS232 or RS422/RS485
  • Full or half-duplex
  • Data rates up to 115,200 bit/s
  • 60-byte transmit/receive buffer
  • Handshake lines: RTS, CTS
  • Available via ESMini connector
CAN bus
  • Two CAN bus channels
  • 2.0 A/B CAN protocol
  • Data rates up to 1 Mbit/s
  • Available via ESMini connector
I²C Bus
  • Two interfaces
  • Available via ESMini connector
PCI Express
  • One x1 link to connect legacy I/O (FPGA)
  • One x1 link via ESMini connector
  • Data rate 250 MB/s in each direction (2.5 Gbit/s per lane)
  • One line from board controller on ESMini connector J1
  • Three lines from FPGA on ESMini connector J1
  • Up to 19 differential pairs of receive and transmit lines on ESMini connector J2
  • Up to 116 single I/O lines on ESMini connector J2
HD Audio
Via ESMini connector
Board Management Controller
  • Input voltage supervision
  • Power sequencing
  • Board monitoring
  • Watchdog
  • Accessible via SMBus
  • Real-time clock (with Goldcap or battery backup on the carrier board)
  • SMBus interface
Electrical Specifications
  • Supply voltage: +5V (-3%/+5%)
  • Power consumption:
    • 1.1 GHz Z510 model: 6.75 W typ., 7.7 W max.
    • 1.6 GHz Z530 model: 7.5 W typ., 9.3 W max.
Mechanical Specifications
  • Dimensions: 95 mm x 55 mm
  • ESMini PCB mounted between a frame and a cover
  • Weight: 130 g (with cover and frame)
Environmental Specifications
  • Temperature range (operation):
    • -40..+85°C Tcase (ESMini cover/frame) (board versions with 512 MB DDR2 SDRAM)
    • -25..+85°C Tcase (ESMini cover/frame) (board versions with 1 GB DDR2 SDRAM)
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to + 3,000 m
  • Shock: 15 g/11 ms (EN 60068-2-27)
  • Bump: 10 g/16 ms (EN 60068-2-29)
  • Vibration (sinusoidal): 1 g/10..150 Hz (EN 60068-2-6)
  • Conformal coating on request
221,026 h @ 40°C according to IEC/TR 62380 (RDF 2000)
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC behavior depends on the system and housing surrounding the ESMini module. MEN has performed general, successful EMC tests for ESMini using the XC4 evaluation carrier according to EN 55022 (radio disturbance), IEC 61000-4-2 (ESD), IEC 61000-4-3 (electromagnetic field immunity), IEC 61000-4-4 (burst), IEC 61000-4-5 (surge) and IEC 61000-4-6 (conducted disturbances)
BIOS/Boot Loader
Award BIOS
Software Support


Short-form Data Sheet
User Manuals
Windows XP Embedded BSP (MEN) for F11S, F14, F15, F17, F18, F19P, F21P, G20, XM1, XM1L, XM2, MM1, MM2, DC1, DC2, DC13, RC1, BC50I, BC50M, BL50W and BL50S
(ZIP, 168 MB, Windows)
QNX 6.3 installation support files (MEN) for F14, F15, F17, F18, F19P, XM1, XM2 and MM1
(ZIP, 4 MB, QNX)
QNX native driver (MEN) for 16Z087_ETH
(ZIP, 195 KB, QNX)
Windows native driver (MEN) for 16Z087_ETH
(ZIP, 4 MB, Windows)
MDIS4 system package (MEN) for QNX
(ZIP, 14 MB, QNX)
MDIS5 System Package (MEN) for VxWorks
(ZIP, 19 MB, VxWorks)
Windows Installset (MEN) for MM1 and RC1
(ZIP, 132 MB, Windows)
MDIS5 System Package (MEN) for Linux
(ZIP, 12 MB, Linux)
Windows Installset (MEN) for MM1 and RC1
(ZIP, 52 MB, Windows)
Windows HD Audio driver (Realtek) for XM1, XM1L and MM1
(ZIP, 25 MB, Windows)
Windows graphics driver (Intel) for XM1, XM1L and MM1
(ZIP, 2 MB, Windows)
Windows chipset driver (Intel) for XM1, XM1L, MM1 and F11S
(ZIP, 4 MB, Windows)
Windows USB client driver installation package (Intel) for XM1, XM1L and MM1
(ZIP, 9 MB, Windows)
Windows Vista HD audio driver (Realtek) for XM1, XM1L and MM1
(ZIP, 22 MB, Windows)
Windows Vista chipset graphics driver (Intel) for XM1, XM1L, MM1 and F11S
(ZIP, 18 MB, Windows)
MDIS5 Windows driver (MEN) for 16Z029_CAN (MSCAN/Layer2)
(ZIP, 5 MB, Windows)
MDIS5 Windows driver (MEN) for 16Z034_GPIO
(ZIP, 10 MB, Windows)
QNX native driver (MEN) for 16Z025_UART and 16Z125_UART
(ZIP, 184 KB, QNX)
QNX 6.4 native driver (MEN) for 16Z025_UART and 16Z125_UART
(ZIP, 239 KB, QNX)
QNX 6.5 native driver (MEN) for 16Z025_UART and 16Z125_UART
(ZIP, 256 KB, QNX)
Application Notes
Errata & Technical Information