M199 - M-Module USM FPGA Development Kit (Product Discontinued)

USM Universal Submodules make M-Modules more flexible, cost and time-saving than ever. A main M-Module gets its specific function through the IP cores implemented inside its onboard FPGA. This function can be changed at any time through implementation ofdifferent IP cores. The corresponding line drivers are realized on a USM which is simply plugged on the main M-Module.

This FPGA USM development kit for M-Modules has been prepared for users who like to write and/or implement specific IP cores on their own. Even the growing range of Wishbone-based standard IP cores from MEN (different UARTs, Ethernet, fieldbus interfaces, graphics, digital I/O etc.) can be combined with your own or third-party functions.

The kit includes the main M-Module M199 equipped with an FPGA, 32 MB DDR2 SDRAM, 8 MB Flash and a 50-pin SCSI connector. In addition the package includes a bare USM module, a test board where I/O signals from the FPGA are led to and where an additional debug interface is implemented, and a SCSI cable for connection between the main M-Module and test board. The Nios processor, memory control, and the Avalon/Wishbone bridges are installed on the main module. The corresponding FPGA development package is available as web download. For development of IP cores on the standard Wishbone bus the Wishbone Bus Maker tool from MEN is included. In order to use the Nios cores and to develop IP cores on the Avalon bus Altera's Quartus II design environment including the SOPC builder is needed separately.

ANSIstandard mezzanine M-Modules can be used as an I/O extension in any type of bus system, i.e. CPCI, VME or on any type of stand-alone SBC. Appropriate M-Module carrier cards in 3U, 6U and other formats are available from MEN or other manufacturers.

Once a USM module has been developed for M-Modules, it may also be used on PMC or XMC and conduction-cooled PMC base modules, and vice versa.


  • 1 Main M-Module M199 for USM Universal Submodules:
  • 1 FPGA 33,216 LE
  • 32 MB DDR2 SDRAM, 8 MB Flash
  • 1 bare USM module US0
  • 1 evaluation board with RS232 debug interface
  • 1 FPGA development package:
  • Main bus interface
  • Memory control
  • Nios softcore
  • Wishbone/Avalon bridges
  • For user-defined I/O
  • 1 SCSI cable
  • -40 to +85 °C with qualified components


Evaluation Board AD99
  • 50-pin connection to M199
    • SCSI 2 connector
    • 46 I/O signals from/to M199
  • Six SA-Adapter slots
    • For direct onboard connection
    • 46 I/O signals from/to SCSI 2 connector
    • RS232 SA-Adapter SA1 included
  • Three 20-pin I/O connectors
    • 46 I/O signals from/to SCSI 2 connector
  • Eight user LEDs at front, driven by I/O signals
M-Module M199 (USM main module)
  • CPU
    • Nios II soft processor
    • 66MHz
  • Memory
    • 32MB DDR2 SDRAM, soldered
    • 8MB non-volatile Flash, for FPGA data and Nios firmware
  • I/O at front panel (SCSI 2 connector)
    • One LVTTL UART (for RS232 on AD99 via SA1 SA-Adapter)
  • Functions in FPGA
  • USM Slot
    • One slot populated with bare USM module US0
    • US0 only passes through signals between the FPGA and the front connector and reduces +5V input levels to 3.3V system I/O level
  • Connection to evaluation board
    • SCSI 2 connector, 50-pin HP D-Sub receptacle
    • 46 I/O signals from/to evaluation board, FPGA-controlled
  • M-Module Characteristics
    • Compliant with M-Module standard
    • A08, A24, D08, D16, D32, INTA, IDENT
  • SA1 RS232 SA-Adapter
  • SCSI 2 cable
  • Please note that the kit does not include an M-Module carrier board! You should install the M-Module on a suitable carrier in a test system of your choice.
Electrical Specifications
  • Supply voltage/power consumption:
    • M199 with US0: +5V (-3%/+5%), 1000mA max.
    • AD99: +5V, consumption only depends on SA-Adapter used, current drawn on I/O lines and LEDs driven, with 1 SA1 and all 8 LEDs on approx. 100mA typ.
    • SA1: +5V (-3%/+5%), 40mA typ.
  • MTBF:
    • M-Module USM Development Kit (total): 319,364h @ 40°C according to IEC/TR 62380 (RDF 2000)
    • M199: 533,355h @ 40°C according to IEC/TR 62380 (RDF 2000)
    • US0: 1,989,261h @ 40°C according to IEC/TR 62380 (RDF 2000)
    • AD99: 1,469,985h @ 40°C according to IEC/TR 62380 (RDF 2000)
    • SA1: 1,870,000h @ 50°C (derived from MIL-HDBK-217F)
Mechanical Specifications
  • Dimensions:
    • M199: conforming to M-Module standard
    • US0: conforming to USM standard
    • AD99: standard single Eurocard, 100mm x 160mmm
    • SA1: 32mm x 42mm
  • Weight:
    • M199: 70g
    • US0: 20g
    • AD99: 90g
    • SA1: 16g
Environmental Specifications
  • Temperature range (operation):
    • 0..+60°C
    • Airflow: min. 10m³/h
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300m to + 3,000m
  • Shock: 15g/11ms
  • Bump: 10g/16ms
  • Vibration (sinusoidal): 2g/10..150Hz
  • Conformal coating on request
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
Tested according to EN 55022 (radio disturbance), IEC 61000-4-2 (ESD) and IEC 61000-4-4 (burst)
Software Support