The CB70C is a member of a new family of Rugged COM Express modules which is controlled by a third generation Intel Core i7 processor running at up to 3.1 GHz maximum turbo frequency bringing state-of-the-art PC technology onto a small form factor. This means a scalable performance with 1 up to 4 cores, integrated graphics, as well as support of Intel AMT or Open CL 1.1.

The board can be controlled using a Board Management Controller and an adaptable BIOS which ensures flexibility in tailoring the complete system for the final application. Intel AMT support is actively integrated in the BIOS adaptation.

The modules are 100% compatible to COM Express modules of Pin-out Type 6. They conform to the new VITA-59 standard which specifies the mechanics to make COM Express modules suitable for operation in harsh environments.

The modules are embedded in a covered frame ensuring EMC protection and allowing efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover.

The CB70C accommodates up to 16 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

The interfaces include a combination of PCI Express links, LVDS, DDI, VGA, high-definition audio, SATA, Ethernet and USB.

The CB70C is screened for operation from -40°C to +85°C (Tcase). Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating.

For evaluation and development purposes a microATX carrier board, the XC15, is available.