XM2 - ESMexpress COM with Intel Core 2 Duo (Product Discontinued)

The XM2 is a Computer-On-Module which together with an application-specific carrier board forms a semi-custom solution for industrial, harsh, mobile and mission-critical environments.

The XM2 is controlled by a Intel Core 2 Duo CPU with a clock frequency of up to 2.26 GHz and a total power consumption of up to 40W.

The XM2 can accommodate 4 GB of DDR3 DRAM memory and supports other memory like USB Flash on the carrier board.

The GS45 graphics controller supports x16 PCI Express Graphics or up to two SDVO interfaces, or one LVDS port.

In addition, four x1 or one x4 PCI Express links are supported by the XM2. Other modern serial interfaces are 2 Gigabit Ethernet channels, 8 USB ports, 3 SATA ports, and one HD audio port. These interfaces are all routedfrom the XM2 for availability on any ESMexpress carrier board.

The XM2 is completed by a board management controller for temperature and power supervision. It comes with an InsydeH2O EFI BIOS configurable for the final application.

The XM2 is screenedfor operation from 0°C to +85°C (Tcase). As all ESMexpress modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling. Air cooling is alsopossible by applying a heat sink on top of the cover. With a low power processor the module may even be operated in an extended temperature range. ESMexpress modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. All ESMexpress modules support a single 95x125mm form factor.

For evaluation and development purposes an ATX carrier board is available. The ESMexpress module can be evaluated on a COM Express carrier board via an adapter from ESMexpress to COM Express.


  • Intel Core 2 Duo up to 2.26 GHz
  • Up to 4 GB DDR3 SDRAM
  • 1 x16 PCI Express Graphics link
  • 4 x1 PCI Express links
  • 2 Gb Ethernet
  • 3 SATA ports
  • 8 USB 2.0
  • Up to 2 SDVO ports
  • Intel HD audio
  • 0°C to +85°C Tcase screened
  • Conduction cooling


  • Intel Core 2 Duo SP9300
    • Up to 2.26GHz processor core frequency
    • 800/1066MHz system bus frequency
  • Chipset
    • Northbridge: Intel GS45
    • Southbridge: Intel ICH9M-E
  • Up to 6MB L2 cache integrated in Core 2 Duo
  • Up to 4GB DDR3 SDRAM system memory
    • Soldered
    • 800/1067MHz memory bus frequency locked to the FSB frequency
Serial ATA (SATA)
  • Three ports via ESMexpress connector
  • Transfer rates up to 3Gbit/s (SATA 3.0)
  • Integrated in Intel GS45 chipset
  • Maximum resolution: 2048 × 1536 pixels (QXGA)
  • One x16 link (PCI Express graphics) or
  • Up to two SDVO ports
  • One LVDS port (4 bit, max. 1366x768)
  • Available via ESMexpress connector
  • Eight USB 2.0 host ports
  • UHCI implementation
  • Data rates up to 480Mbit/s
  • Available via ESMexpress connector
  • Two 10/100/1000Base-T Ethernet channels
  • Ethernet controllers connected by two x1 PCIe links
  • Two LED signals per channel for LAN link, activity status and connection speed
  • Available via ESMexpress connector
PCI Express
  • Two x1 links to connect local 1000Base-T Ethernet controllers
  • Four x1 links or one x4 link via ESMexpress connector (switchable on the carrier)
  • Data rate 250MB/s in each direction (2.5 Gbit/s per lane)
  • 1 line from PIC via ESMexpress connector
  • Usable for LED
HD audio
Via ESMexpress connector
Board Management Controller
  • Input voltage supervision
  • Power sequencing
  • Board monitoring
  • Watchdog
  • Accessible via SMBus
  • Real-time clock (with GoldCap or battery backup on the carrier board)
  • SMBus interface
Electrical Specifications
Supply voltage/power consumption:
  • +12V (-25%/+33%), power consumption up to 40W
  • +5V (-5%/+5%) standby voltage
Mechanical Specifications
  • Dimensions: 95mm x 125mm
  • ESMexpress PCB mounted between a frame and a cover
  • Weight: 230g (incl. cover and frame)
Environmental Specifications
  • Temperature range (operation): 0..+85°C Tcase (ESMexpress cover/frame)
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300m to + 3,000m
  • Shock: 15g/11ms (EN 60068-2-27)
  • Bump: 10g/16ms (EN 60068-2-29)
  • Vibration (sinusoidal): 1g/10..150Hz (EN 60068-2-6)
  • Conformal coating on request
154,077h @ 40°C according to IEC/TR 62380 (RDF 2000)
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
  • EMC behavior depends on the system and housing surrounding the ESMexpress module.
  • MEN has performed general, successful EMC tests for ESMexpress using the XC1 evaluation carrier according to:
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
BIOS/Boot Loader
InsydeH2O UEFI Framework
Software Support


Short-form Data Sheet
User Manuals
Technical Drawings
Application Notes
Errata & Technical Information