F50C - PowerPC MPC8548 Conduction Cooled SBC (Product Discontinued)

The F50C is a versatile, rugged PowerPC based single-board computer for embedded applications with conduction cooling. It is controlled by an MPC8548, or optionally an MPC8543 PowerPC CPU (alternatively with encryption unit) with clock frequencies between 800 MHz and 1.5 GHz. The SBC is equipped with ECC-controlled, soldered-on DDR2 RAM for data storage, with up to 16 GB of solid-state Flash disk for program storage as well as industrial FRAM and SRAM.

The CPU card provides up to three Gigabit Ethernet channels, four USB ports, up to two SATA interfaces and up to 64 user-definable I/O lines controlled by its onboard FPGA. These interfaces can be combined in many variations and are all available at the rear using the board's J2 connector. For first operation and service purposes, the board also includes a UART-to-USB port accessible at the front panel.

The F50C is based on a standard 3U CompactPCI card that is embedded into a dedicated CCA frame for conduction cooling (CCA = conduction cooled assembly). The 9-HP assembly can be used with MEN's conduction-cooled subrack. It is designed for operation in a -40°C to +85°C environment. For convection cooling, the F50P model is also available, which comes with a tailor-made heat sink for extended temperatures.

The large FPGA on the F50C allows to add additional user-defined functions such asgraphics, touch, serial interfaces, fieldbus controllers, binary I/O etc. for the needs of the individual application in an extremely flexible way. Before boot-up of the system, the FPGA is loaded from boot Flash. Updates of the FPGA contents can be madeinside the boot Flash during operation.

Equipped with a PCI-bridge chip, the F50C offers a full CompactPCI interface (system slot functionality) for reliable system expansion. Apart from that, the F50C can also be used as a busless, stand-alone board, with power supply from the backplane.

The soldered components on the F50C withstand shock and vibration, and the board design is optimized for conformal coating.

The F50C comes with MENMON support. This firmware/BIOS can be used for bootstrapping operating systems (from disk, Flash or network), for hardware testing, or for debugging applications without running any operating system.


  • 32-bit/33-MHz cPCI system slot
  • 1 slot, 9 HP front, rear I/O
  • MPC8548 (or MPC8543), up to 1.5 GHz
  • Up to 2 GB (ECC) DDR2 SDRAM
  • Up to 128 KB FRAM, 2 MB SRAM
  • Up to 16 GB SSD Flash
  • FPGA for user-defined I/O functions
  • MENMON BIOS for PowerPC cards
  • -40°C to +85°C Tcase screened
  • Conduction cooling


PowerPC PowerQUICC III MPC8548, MPC8548E, MPC8543 or MPC8543E
  • 800MHz up to 1.5GHz
  • Please see Standard Configurations for available standard versions.
  • e500 PowerPC core with MMU and double-precision embedded scalar and vector floating-point APU
  • Integrated Northbridge and Southbridge
  • 2x32KB L1 data and instruction cache, 512KB/256KB L2 cache integrated in MPC8548/MPC8543
  • Up to 2GB SDRAM system memory
    • Soldered
    • DDR2 with or without ECC
    • Up to 300 MHz memory bus frequency, depending on CPU
  • Up to 16GB soldered Flash disk (SSD solid state disk)
  • Up to 32MB additional DDR2 SDRAM, FPGA-controlled, e.g. for video data
  • 16MB boot Flash
  • 2MB non-volatile SRAM
    • With GoldCap backup
  • 128KB non-volatile FRAM
  • Serial EEPROM 4kbits for factory settings
Mass Storage
Rear I/O
  • Real-time clock with GoldCap backup
  • Temperature sensor, power supervision and watchdog
CompactPCI Bus
  • Compliance with CompactPCI Core Specification PICMG 2.0 R3.0
  • System slot
  • 32-bit/32-MHz PCIe-to-PCI bridge
  • V(I/O): +3.3V (+5V tolerant)
Busless Operation
  • Board can be supplied with +5V, +3.3V and +12V from backplane, all other voltages are generated on the board
  • Backplane J1 connector used only for power supply
Electrical Specifications
Supply voltage/power consumption:
  • +5V (-3%/+5%), 800mA approx.
  • +3.3V (-3%/+5%), 350mA approx.
  • ±12V (-5%/+5%), 1A approx.
Mechanical Specifications
Environmental Specifications
  • Temperature range (operation):
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300m to + 3,000m
  • Shock: 15g/11ms
  • Bump: 10g/16ms
  • Vibration (sinusoidal): 1g/10..150Hz
  • Conformal coating on request
150,290h @ 40°C according to IEC/TR 62380 (RDF 2000)
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
Tested according to EN 55022 (radio disturbance), IEC 61000-4-2 (ESD) and IEC 61000-4-4 (burst)
BIOS/Boot Loader
Software Support