CC10 - Rugged COM Express Module with ARM i.MX6

Scalable Processor Performance

The CC10 is an Ultra-Rugged COM Express module built around the NXP (formerly Freescale) ARM i.MX 6 series of processors with a Cortex-A9 architecture. Supporting different types of the i.MX 6Solo, 6DualLite, 6Dual and 6Quad families, the computer-on-module is widely scalable, e.g., to processing or graphics requirements. Where less performance is needed, you can optimize costs by choosing a single- or dual-core processor instead of a quad core.

Perfect for Harsh Environments

For applications that need reliable operation even under the harshest environmental conditions, a specially hardened version is available - the CC10C. CC10C modules are embedded in a closed aluminum frame that ensures optimum EMC protection and efficient conduction cooling and supports an extended operating temperature range of -40 °C to +85 °C. Direct air cooling is possible by placing a heat sink on the cover. The innovative mechanical design around the COM.0 electronics makes it an ultra-rugged module. With the mechanics for conduction cooling, the module's size extends to 105 x 105 mm. The CC10 is based on the "Compact", 95 x 95 mm form factor and Type 6 connector pin-out. The exclusive use of soldered components ensures that the COM withstands shock and vibration. The design is optimized for conformal coating. Adding to its rugged design, the computer-on-module's range of supported functions leave almost nothing to wish for. With a maximum of 4 GB DDR3 RAM and an onboard eMMC device, the CC10 covers all basic memory needs. 3-Gbit SATA is provided for external mass storage.

I/O Flexibility

One of the biggest strengths of the CC10 lies in its I/O flexibility. The i.MX 6 provides an abundance of onchip controllers and interfaces, including Gigabit Ethernet, USB 2.0 (also with OTG/client support) and PCI Express. Different video outputs like LVDS and HDMI/DVI, audio and an optional camera interface make the card fit for multimedia applications. Other serial ports provide UARTs or CAN bus. Where the processor's standard functions are not a perfect match, an onboard FPGA opens up 140 signal pins for user I/O. As IP cores are easy to integrate, the CC10 becomes a semi-custom solution with the suitable functionality even for more specialized applications. The resulting I/O functionality in the ordered version depends on the customer's requirements and will always be a tailored combination of i.MX 6 and FPGA-based I/O, without the need for a completely new design. For evaluation and development purposes a microATX carrier board, the XC15, is available.

Features

  • NXP ARM i.MX 6 Series
  • Quad-core processor
  • Comprehensive usage of i.MX 6 I/O
  • Configurable FPGA I/O with 140 pins
  • Maximum flexibility in interface configuration
  • Up to 4 GB DDR3 SDRAM
  • eMMC multimedia card
  • U-Boot Universal Boot Loader
  • -40 °C to +85 °C Tcase
  • Conduction cooling
  • Compliant with COM Express Compact, type 6
  • PICMG COM.0 and Ultra-Rugged COM versions

Specifications

CPU
Memory
  • System RAM
    • Soldered DDR3
    • 1 GB
    • 2 GB
    • 4 GB max.
  • Boot Flash
    • 4 MB
    • 16 MB max.
Mass Storage
The following mass storage devices can be assembled:
  • eMMC device, soldered; different sizes available
Graphics
  • Integrated in i.MX 6 processor
  • Multi-stream-capable HD video engine delivering up to 1080p60 decode, 1080p30 encode and 3D video playback in HD
  • Maximum resolution: 1920 x 1200 pixels (WUXGA)
  • Superior 3D graphics performance with up to four shaders performing 200 Mt/s and OpenCL support
  • Separate 2D and/or OpenVG Vertex acceleration engines for optimal user interface experience
  • Stereoscopic image sensor support for 3D imaging
Interfaces
  • Video
    • 1x HDMI/DVI, board to board
    • 1x LVDS, dual-channel, board to board
    • 1x MIPI CSI-2 camera serial host interface, board to board; optional
    • 1x MIPI CSI-2 camera serial host interface, two data lanes (with i.MX6S/i.MX6DL), or
    • 1x MIPI CSI-2 camera serial host interface, four data lanes (with i.MX6D/i.MX6Q), or
    • No MIPI CSI-2 camera interface
  • Audio
    • 1x AC'97 audio, board to board
    • 1x I2S audio, board to board
  • SATA
    • 1x SATA Revision 2.x, board to board; only with i.MX6D or i.MX6Q
    • None
  • SDIO/SDHC
    • 1x, board to board, for MMC/SD/SDIO cards
  • USB
    • 2x USB 2.0, board to board, or
    • 7x USB 2.0, board to board
    • One channel always implemented as OTG (On-The-Go) host/client channel
  • Ethernet
    • 1x 1000BASE-T, board to board
    • 1x 100BASE-T, board to board; optional
    • Link and activity LED signals
  • PCI Express
    • 1x PCIe 1.1 x1, board to board
  • ExpressCard
    • 1x, board to board
  • Serial
    • 6x UART, board to board, max., 4 Mbit/s max.
    • Two interfaces (UART0, UART1), 4 Mbit/s
    • Four interfaces (UART2, UART3, UART4, UART5), 3 Mbit/s, or
    • Two interfaces (UART2, UART3), 4 Mbit/s; two interfaces (UART4, UART5), up to 3 Mbit/s, or
    • Two interfaces (UART2, UART3), 4 Mbit/s
    • Physical interfaces RS232 or RS422/RS485 depending on interface controller and implementation on carrier board
  • CAN bus
    • 2x, board to board, 2.0B CAN protocol, 1 Mbit/s
    • 2x additional, board to board, 2.0A/B CAN protocol, 1 Mbit/s; with FPGA; optional
    • External transceivers to be implemented on carrier board
  • PWM
    • 3x PWM, board to board
  • I2C
    • 4x I2C, board to board, max.
    • Two I2C interfaces, with MIPI CSI-2 device support
    • Two I2C interfaces, without MIPI CSI-2 device support
    • Two I2C interfaces; optional
  • SPI
    • 3x SPI, board to board, max.
    • One SPI interface
    • Two SPI interfaces
    • Three SPI interfaces
  • Power and system management control signals
  • GPIO
    • 9x GPIO, 4x GPO, 3x GPI, board to board
    • 64x GPIO, board to board, with FPGA; optional
FPGA
Supervision and Control
  • Power supervision and watchdog
  • Temperature measurement
    • i.MX 6 temperature measurement
    • Additional onboard temperature sensor; optional
  • Real-time clock, buffered by supercapacitor or battery on the carrier board
Product Standard
  • Compact, Type 6, PICMG COM.0 COM Express Module Base Specification
  • Compact, Type 6, Ultra-Rugged COM
Electrical Specifications
  • Supply voltage
    • +12 V (9 to 16 V)
  • Power consumption
    • 12 W, measured in stress test using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 7.4 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
    • 5 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10-00, i.MX6S single-core @ 800 MHz
Mechanical Specifications
  • Dimensions
    • COM Express Compact: (W) 95 mm, (D) 95 mm
    • Ultra-Rugged COM Compact: (W) 105 mm, (D) 105 mm, (H) 18 mm
  • Weight
    • 356 g (model 15CC10C00)
    • 40 g (model 15CC10-00)
  • Cooling
    • Conduction cooling
    • Air cooling
Environmental Specifications
  • Temperature range (operation)
    • -40 °C to +85 °C Tcase (conduction-cooling cover/frame) (model 15CC10C00)
    • -40 °C to +85 °C Tcase (conduction-cooling cover/frame) (screened components) (for processor types not available as qualified)
    • -40 °C to +85 °C (model 15CC10-00)
    • -40 °C to +85 °C (screened components) (for processor types not available as qualified)
  • Temperature range (storage): -40 °C to +85 °C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +3000 m
  • Shock: 50 m/s², 30 ms (EN 61373)
  • Vibration (function): 1 m/s², 5 Hz to 150 Hz (EN 61373)
  • Vibration (lifetime): 7.9 m/s², 5 Hz to 150 Hz (EN 61373)
  • Conformal coating; optional
Reliability
MTBF
  • 652 986 h predicted @ 40 °C according to IEC/TR 62380 (RDF 2000) (model 15CC10C00)
  • 1 233 470 h predicted @ 40 °C according to IEC/TR 62380 (RDF 2000) (model 15CC10-00)
Safety
Flammability (PCBs): UL 94 V-0
EMC
  • EMC behavior generally depends on the system and housing surrounding the COM module.
  • The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
    • EN 55022 (radio disturbance)
    • IEC 61000-4-2 (ESD)
    • IEC 61000-4-3 (electromagnetic field immunity)
    • IEC 61000-4-4 (burst)
    • IEC 61000-4-5 (surge)
    • IEC 61000-4-6 (conducted disturbances)
Software Support
BIOS/Boot Loader
U-Boot Universal Boot Loader

Downloads