A25 - Embedded Single Board Computer with Intel Xeon D (Product Discontinued)

Latest Intel Xeon Technology

The A25 is a high-performance multicore VMEbus CPU board based on Intel's Xeon D-1500 server CPU. The VMEbus interface is implemented as an open-source, FPGA-based solution. This makes it both future-proof and cost-efficient with comprehensive functionality. The A25 supports a reduction of system size, a reliable long-term operation without forced air cooling, and manifold computing functions with just one computer board.

Versatile Front I/O and Mass Storage

With two USB ports, three Gigabit Ethernet ports and two RS232 COMs at the front, the board offers the crucial basics of a multi-purpose industrial computer. Being equipped with DDR4 SDRAM with ECC and Flash, the need for flexible mass storage extensions is covered by slots for microSD and mSATA.

Flexible Interfaces via PMC/XMC

In addition, the A25 can be equipped with one XMC/PMC mezzanine card and one PCI Express Mini Card, providing additional front I/O (XMC/PMC) for functions such as graphics, mass storage, or further Ethernet. The PMC slot supports modules up to 64-bit/133-MHz PCI-X, while the XMC slot is controlled by one PCI Express x8 link. The modular extension with I/O mezzanines on a single-board computer allows to configure tailored systems from open standard components, reducing integration time and cost.

Designed for Harsh Environments

The A25 supports operation in a -40 °C to +60 °C temperature range. The rugged board withstands shock and vibration as all components on the board are soldered, which is a prerequisite for reliable operation and a longer product life-time.

Demanding Markets

The A25 is a computer board well suited for critical embedded applications, especially in the industrial automation and power & energy markets, for example as the central safety platform for power plants.


  • Intel Xeon D-1500 (Broadwell DE)
  • Up to 16 cores and 32 threads
  • 64-bit VMEbus master and slave interfaces
  • Up to 32 GB DDR4 DRAM soldered, ECC
  • Front I/O: 3 Gb Ethernet, 2 USB 3.2 Gen 1x1, 2 COM
  • Rear I/O: 2 Gb Ethernet
  • 1 PMC/XMC slot
  • Trusted Platform Module (TPM)