D203
M-Module Carrier Board for 4 Mezzanine Cards
6U CompactPCI

Main Features
- 1 CompactPCI bus slot
- 4 M-Module slots
- -40 °C to +85 °C
Description
The D203 is a 6U M-Module carrier board for universal I/O on the CompactPCI bus. It allows high flexibility in applications such as data acquisition or process control. You can install up to four M-Modules on the D203, which needs only one slot on the CompactPCI bus. All M-Modules are screwed tightly on the board and require no separately mounted transition panel.
The D203 offers developers immediate access to more than 70 different M-Modules for I/O in fields such as process I/O, measurement, instrumentation, motion control, communication, and development.
Long-Term Availability
Long-term availability ensures an extended product life and future-safety.
M-Module Slots
- Four M-Module slots
- Compliant with M-Module standard
- Characteristics: A08, A24, D08, D16, D32, INTA, TRIGI, TRIGO
- One pass-thru window per M-Module
Peripheral Connections
- Via front panel
- Via CompactPCI J4/J5
- With or without J4/J5 (optional)
CompactPCI Bus
- Compliance with CompactPCI Specification 2.0 R2.1
- Only one slot required on the 6U CompactPCI bus
- 32-bit/33-MHz PCI-to-M-Module bridge
- FPGA-based
- Compliant with PCI Specification 2.2
- Target on PCI bus
- V(I/O): +5 V (+3.3 V on request)
Electrical Specifications
- Supply voltage/power consumption:
- +5 V (-3%/+5%), 20 mA typ.
- +3.3 V (-3%/+5%), 20 mA typ.
- Only M-Modules with a maximum allowed input voltage of 60 V DC are allowed on this board.
- MTBF: 470 000 h @ 50 °C (derived from MIL-HDBK-217F)
Mechanical Specifications
- Dimensions: conforming to CompactPCI specification for 6U boards
- Front panel: aluminum with 2 handles, cut-outs for front connectors of 4 M-Modules
- Weight: 260 g
Environmental Specifications
- Temperature range (operation):
- 0 °C to +60 °C or -40 °C to +85 °C
- Airflow: min. 10 m³/h
- Conduction cooling (on request)
- Temperature range (storage): -40 °C to +85 °C
- Relative humidity range (operation): max. 95% non-condensing
- Relative humidity range (storage): max. 95% non-condensing
- Altitude: -300 m to +3000 m
- Shock: 15 g / 11 ms
- Bump: 10 g / 16 ms
- Vibration (sinusoidal): 2 g / 10 Hz to 150 Hz
Safety
Flammability (PCBs): UL 94 V-0
EMC
- EN 55032:2015+A11:2020+A1:2020
- EN 55035:2017+A11:2020
- EN 50121-3-2:2016+A1:2019
- EN 301 489-1 V2.2.3
- EN IEC 63000:2018
- Regelung Nr. EMV 06 - Anhang E Ausgabe 2.0 (2019-05-09)
Software Support
- M-Module drivers for Windows, VxWorks, Linux, QNX as supported
- Basic board driver included in MDIS system package for the respective operating system
Standard Models
02D203-00
M-Module carrier board, with J4/J5 for rear I/O, 0 °C to +60 °C
02D203-07
M-Module carrier board, A24 access, with J4/J5 for rear I/O, -40 °C to +85 °C qualified
Accessories - Miscellaneous
05M000-15
Front-panel cover for M-Module cut-outs at front panels, snap-in, 10 pcs
05M000-17
25 mounting screw sets to fix M-Modules on carrier boards (3 different screw types, 50 pieces each)
13MD05-70
13MD05-71
MDIS Class Installer Fix for duagon Windows Driver and Software Packages
File Name: 13md05-71.zip
|
Released: 14. February, 2025
ZIP
|
3 MB
SHA1 Checksum: e5b84eee0371f5f2b89652358f7f1045ba0621be
Details
Data Sheets
Errata & Technical Information